COM Express Modules
High performance, COM Express modules
Procelerant CEQM57
Next Generation Performance
The Procelerant™ CEQM57 combines the next generation performance Intel® Core™ i5 and i7 processors and the Mobile Intel® QM57 Express chipset with RadiSys design expertise to provide breakthrough processing performance on a basic size COM Express module.
- Intel® Core™ i5 and i7 Processor options
- Intel Core™ i7 610E 2.53GHz
- Intel Core™ i7 620LE 2.0GHz
- Intel Core™ i7 620UE 1.06GHz
- Intel Core™ i5 520E 2.4GHz
- Mobile Intel® QM57 Express chipset
- Dual–channel DDR3, up to 8GB
- Type 2 and Type 3 pin–out options
- TPM
- Support for SSDDR (Solid State Disk on SODIMM form factor) for up to 32 GB NAND flash memory or up to 8 GB DDR3 memory
- Six PCI Express x1 ports, one PCI Express x8 port (or a build–option to support PCI Express x16 expansion port)
- Single or dual Gigabit Ethernet options
Procelerant CEQM57XT
Next Generation Performance
The Procelerant® CEGM57 combines the next generation performance Intel® Core™ i5 and i7 processors and the Mobile Intel® QM57 Express chipset with RadiSys -25C to +70C extended temperature range specifications to provide breakthrough processing performance on a ruggedized basic size COM Express module.
Procelerant CEQM57/ECC
Next Generation Performance
The Procelerant® CEGM57-ECC combines the next generation performance Intel® Core™ i5 and i7 processors with ECC memory and the Mobile Intel® QM57 Express chipset to provide breakthrough processing performance on a basic size COM Express module.
Procelerant Z500
85mm x 70mm COM based on Intel® ATOM™ Processor
The RadiSys Procelerant® Z500 COM Module is the innovative combination of Intel’s low power 1.6GHz ATOM™ processor on a 85mm x 70mm standardized Type 2 COM Express module. The ATOM™ processor delivers unprecedented performance and ultra low power in the smallest COM footprint possible.
Procelerant CEGM45
Core™ 2 Duo Processor COM Express Module
Procelerant™ CEGM45 将新一代 Intel® Core 2 Duo 处理器和 GM45 芯片组与 RadiSys 设计的双通道存储器相结合，可以在 COM Express 基本尺寸模块上提供突破性的处理性能。
Procelerant CEGSXT
Extended Temp Core™2 Duo Processor COM Express Module
Procelerant™CEGSXT 将新一代 Intel® Core 2 Duo 处理器和 GS45 芯片组与 RadiSys 设计的双通道存储器相结合，可以在 COM Express 基本尺寸模块上提供突破性的处理性能。
Procelerant CEZ5XT
Extended Temp Intel® ATOM™ Small Form Factor COM Express Module
RadiSys Procelerant™ CEZ5XT 以 Intel 的低功率1.6GHz ATOM 处理器为基础，该处理器位于一个 85mm x 70mm 的标准信号接口 COM 模块上。ATOM 处理器可以在最小型的 COM 中提供前所未有的性能和超低功率，且该 COM 与型号 2 COM Express 接口定义相兼容。
Procelerant CEZ5XL
Industrial & Commercial Temp Intel® ATOM™ COM Express Module
RadiSys Procelerant CEZ5XL 是行业中的第一个以 IA 为基础的 COM Express 模块，可以在 -40C 至 +85C 的工业温度范围内运行。此模块还配备了增强的 I/O，能够通过 PCI 桥和 PCIe 交换机为 COM Express B2B 连接器提供 5x PCIe 接口。另外，此模块还包含一个 SATA 控制器和可选的板载 PATA SSD。
Procelerant CE3100
配有 ECC 存储器的 Core™ 2 Duo COM Express 模块
RadiSys Procelerant™ CE3100 COM Express 基本尺寸模块 (95mm x 125mm) 兼具 Intel® Core™ 2 Duo L7400 处理器的性能，并配有 ECC 存储器。这是一项对当今嵌入式通讯应用至关重要的特征。与 RadiSys Procelerant 载板配合，RadiSys COM Express 模块为客户提供了可立即使用的开发平台
Procelerant CE738AE
Extended Temperature Range COM Express Module
Procelerant™ CE738A-E modules are rugged, low power, high performance COM Express modules with key features vital for today’s embedded applications.
Procelerant CE945GM2A
Core™ 2 Duo Pentium M 945GM COM Express 模块
基于开放式 PICMG 标准，RadiSys ProcelerantTM CE945GM2A COM Express 基本尺寸模块(95mm x 125mm) 兼备了 Intel® Core™ 2 Duo Pentium M 和单核 Celeron M 的性能及对当今嵌入式应用至关重要的双通道存储器。与 RadiSys Procelerant 载板配合，RadiSys COM Express 模块为客户提供了可立即使用的开发平台
Procelerant CE 915GMA
COM Express Embedded Computing Module
Procelerant™ CE COM Express 模块基于开放式 PICMG 标准，将 Intel® Pentium® M 和 Celeron® M 的性能与当今嵌入式应用中至关重要的关键特征进行了组合。
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