High performance, COM Express modules
The Procelerant™ CEQM57 combines the next generation performance Intel® Core™ i5 and i7 processors and the Mobile Intel® QM57 Express chipset with RadiSys design expertise to provide breakthrough processing performance on a basic size COM Express module.

The Procelerant® CEGM57 combines the next generation performance Intel® Core™ i5 and i7 processors and the Mobile Intel® QM57 Express chipset with RadiSys -25C to +70C extended temperature range specifications to provide breakthrough processing performance on a ruggedized basic size COM Express module.

The Procelerant® CEGM57-ECC combines the next generation performance Intel® Core™ i5 and i7 processors with ECC memory and the Mobile Intel® QM57 Express chipset to provide breakthrough processing performance on a basic size COM Express module.

The RadiSys Procelerant® Z500 COM Module is the innovative combination of Intel’s low power 1.6GHz ATOM™ processor on a 85mm x 70mm standardized Type 2 COM Express module. The ATOM™ processor delivers unprecedented performance and ultra low power in the smallest COM footprint possible.

The Procelerant® CEGM45 combines the next generation performance Intel® Core™ 2 Duo processors and the GM45 chipset with RadiSys designed dual channel memory to provide breakthrough processing performance on a basic size COM Express module.

The Procelerant® CEGSXT combines the next generation performance of Intel® Core™ 2 Duo, Celeron® M processors and the GS45 chipset with RadiSys designed dual channel memory to provide breakthrough processing performance on a basic size COM Express module.

The RadiSys Procelerant™ CEZ5XT is based on Intel's low power 1.6GHz ATOM™ processor on an 85mm x 70mm standardized pin-out COM module. The ATOM™ processor delivers unprecedented performance and ultra low power in the smallest COM footprint possible that is compatible with a Type 2 COM Express pin out.

The Procelerant® CEZ5XL offers two varations: the industry’s first IA-based COM Express module that can operate in industrial temperature range of -40°C to +85°C, as well as the commercial temperature of 0°C to +60°C. The module also features enhanced I/O, a SATA controller and optional on-board PATA SSD.

Based on the open PICMG standard, the RadiSys Procelerant™ CE3100 COM Express basic size (95mm x 125mm) modules combine Intel® Core™2 Duo L7400 processor performance with ECC enabled memory. A key feature for today’s embedded communications applications.

Based on the open PICMG standard, the RadiSys Procelerant™ CE945GME COM Express modules combine Intel® Core™2 Duo Pentium M and single core Celeron M performance with dual channel memory.

Procelerant™ CE915GME COM Express modules combine Pentium-M and Celeron-M performance with the latest serial differential IO technology for today’s embedded applications.
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