Procelerant CEQM57XT

Next Generation Performance

Description

The Procelerant® CEGM57XT combines the next generation performance Intel® Core™ i5 and i7 processors and the Mobile Intel® QM57 Express chipset with RadiSys -25C to +70C extended temperature and vibration specifications to provide breakthrough processing performance on a ruggedized COM Express module. The basic size 95mm x 125mm module is ideal for compute intensive applications such as military–aerospace, transportation and industrial applications requiring high levels of performance and durability. RadiSys delivers the CEQM57XT module in a Type 2 pin out, enabling customers to easily upgrade from their previous generation module while boosting features and performance with up to 8GB memory, additional PCI Express lanes, and improved storage, graphics and audio.

The RadiSys Procelerant® CE family of COM Express products enable customers to start designing at the same time as processor release, saving months of development time and resources. OEM focus can remain on core competencies such as software and application development rather than high speed circuit design. Planned feature changes, demand fluctuations and performance upgrades can be handled without product re–designs using the Procelerant CE family. Procelerant CE modules can reduce service repair inventories, and simplify upgrades, contributing to the success of the product over its lifetime.

EXTREME CAPABILITY AND SUSTAINED RELIABILITY

RadiSys Extended Temperature products are designed with higher capability components and are subjected to an extensive suite of environmental tests to demonstrate capability of operation in -25C to +70C temperature range. With thorough design verification and 100% HASS screening, OEMs can depend on the sustained reliability of the Procelerant® CEQM57XT in harsh, ruggedized environments as required by Military, Aerospace, Government, Transportation and Industrial Automation applications.

COM EXPERT DESIGN SERVICES

OEMs can depend on the RadiSys COM Expert team to support their design at every stage, from schematic checks to the handling of entire custom carrier and system designs. RadiSys COM Expert services include options for software utilities, custom BIOS, mechanical models, debug assistance and more to customers using RadiSys Procelerant® CE processor modules. Design consulting and debug services are also available to support OEM product development at any stage.

In addition to the custom BIOS and carrier design services, OEMs can depend on RadiSys for custom thermal consulting or design to support their extended temperature system design. RadiSys also offers Humiseal 1B31 conformal coating option for the CEQM57. Ask your RadiSys Sales Manager for more information

KICKSTART YOUR APPLICATION DEVELOPMENT WITH COM EXPRESS STARTER KITS

Accelerate a product's development, improve its time to market and reduce overall cost by minimizing the design team's installation requirements and maximizing their efficiency. Procelerant® COM Express Starter Kits arrive integrated onto a CR202 or CR203 development carrier board with heatsink, memory modules, hard drive, DVD drive, and power supply––all using only a single order code.

Feature Summary

-25C to +70C Extended temperature range
Intel® Core™ i5 and i7 Processor options
- Intel Core™ i7 610E 2.53GHz
- Intel Core™ i7 620LE 2.0GHz
- Intel Core™ i7 620UE 1.06GHz
- Intel Core™ i5 520E 2.4GHz
Mobile Intel® QM57 Express chipset
Dual–channel DDR3, up to 8GB
Type 2 and Type 3 pin–out options
TPM
Six PCI Express x1 ports, one PCI Express x8 port
Single or dual Gigabit Ethernet options
Conformal Coat Option - Humiseal 1B31

Specifications

Feature	Function	Description
Processor	610E	Core™ i7 610E 2.53GHz / 4MB cache / 1067MHz FSB/ 35W
	520E	Core™ i5 520E 2.4GHz / 3MB cache 1067MHz FSB / 35W
	620LE	Core™ i7 620LE 2.0GHz / 4MB Cache / 1067MHz FSB/ 25W
	620UE	Core™ i7 620UE 1.06GHz / 4MB Cache / 800MHz FSB /18W
Chipset	Mobile Intel® QM57 Express chipset
Memory	Type	Two 204-pin right-angle SO-DIMM sockets for DDR3-1067 and DDR3-800.
	Capacity	Up to 4GB per channel, for a maximum of 8GB memory
Flash	4MB system flash for BIOS storage
Video	Intel® Gen 5.0 integrated graphics engine	Dual LVDS supports (2) 18 bit or (2) 24 bit panel support resolutions up to 1920x1200 pixels at 60 Hz
		VGA
		One SDVO interface (default) support resolutions up to 1920x1200 pixels at 60 Hz
	External	Build option to support one x16 PCI Express interface for external PCIe x16 graphics device, Embedded Display Port eDP mux'ed with PEG interface
Networking	Type 2	One 10/100/1000BaseT
	Type 3 (Build Option)	Two 10/100/1000BaseT
Audio	High Definition Audio
	Speaker Out
Storage	SATA	4 SATA ports supporting both 1.5 and 3.0 Gbps operation Supports RAID 0, 1, 5 and 10
	USB	One microSD socket (option)
PCI Express	Six PCI Express x1 ports Ports 0–3 configurable as one x4, or two x2; or one x2 and two x1; or four x1 ports Ports 4–5 configurable as two x1 or one x2 ports One PCI Express x8 from PCI Express graphics port supports x1, x2, x4 and x8 devices (Build Option) One PCI Express x16 Graphics Expansion Port
PCI	One PCI 2.3 compliant 32-bit, 33MHz bus
USB	Eight USB 2.0 expansion ports (Build Option for 4 additional USB 2.0 via on–board headers)
LPC	One LPC interface
TPM	Nuvoton (Windbond) WPCT210A
Power	+12 power rail, primary input Supports 9.0V–16.8V power supply
Power Management	ACPI 3.0 supporting states G0/S0, G1/S3, G2/S5, and G3
Miscellaneous	One 100KHz SMBus from PCH
	One 400KHz I²C bus from MCU
	Eight GPIO (four GPI and four GPO)
	Watchdog timer
BIOS	AMI EFI Firmware
OS	Windows XP®	Embedded Professional Professional 64bit
	Windows Vista	Ultimate Edition Ultimate Edition 64bit
	Windows 7	Ultimate Edition Ultimate Edition 64bit
	Red Hat Linux	Enterprise Enterprise 64bit
	Microware® Hypervisor

Physical Specifications

Physical	Dimensions	95mm x 125mm
	Compliance	PICMG COM Express R1.0 Basic Form Factor
	Conformal Coat	Optional - Humiseal 1B31
Environment	Cooling	Forced air	Class EAC1 as defined in the ANSI/VITA 47-2005
		Conduction	Class ECC1 as defined in the ANSI/VITA 47-2005
	Temperature	Operating	Up to 2300m (7500ft) -25°C to +70°C, derated 1.1°C per 300m over 2300m
		Non-operating	-40°C to +85°C
	Shock	Operating	40G, half sine shock pulse, 11ms duration, 3 times per face
		Non-Operating/Unpacked	50G, half sine shock pulse, 11ms duration, 3 times per face (unpackaged)
		Transportation/Packaged	Fixtured assembly: 50G, 17.4 ms trapezoidal pulse Drop test, 10-up bulk packaging, 30in free-fall, one drop on each of six faces
	Vibration (random)	Operating	Random 5Hz to 2KHz, 12.07 grms, 1hr in each of 3 axes 5Hz - 40Hz: 0.04g2/Hz 40Hz to 100Hz: 0.04g2/Hz ramping up to .01g2/Hz(3dB/oct) 100Hz - 1000Hz: 0.1g2/Hz 1000Hz - 2000Hz 0.1g2/Hz ramping down to 0.025g2/Hz (6dB/oct)
		Non-Operating/Storage	Random 5Hz to 2KHz, 12.07 grms, 1hr in each of 3 axes 5Hz - 40Hz: 0.04g2/Hz 40Hz to 100Hz: 0.04g2/Hz ramping up to 0.1g2/Hz (3dB/oct) 100Hz to 1000Hz 0.1g2/Hz 1000Hz - 2000Hz 0.1g2/Hz ramping down to 0.025g2/Hz (6db/oct) 5 - 500Hz swept sine, 2.5 (0-p),
	Humidity	Operating	5% to 95% non-condensing. 95%RH@30C, linear derating to 25%RH@70C
		Non-Operating/Storage	5% to 95% non-condensing
	Altitude	Operating	To 15,000ft (4570m) Up to 2300m (7500 ft), -25°C to +70°C Derated -1.1 C per 305 m (1000 ft) above 2300 m (7500 ft)
		Non-Operating/Storage	To 40,000ft (12000m)
Regulatory	Safety	UL60950-1, EN60950-1, IEC60950-1
		Shall meet RoHS at time of production
	EMC	EN55024, EN55022, and FCC Part 15, Subpart B, Class B
Warranty	Standard	Two years, parts only

Ordering Information

Module Order Codes:

CEQMXT–610E–0: Core™ i7 610E 2.53GHz, 4MB cache, Type 2, single LAN, SDVO, TPM, -25C to +70C
CEQMXT–520E–0: Core™ i5 520E 2.4GHz, 3MB cache, Type 2, single LAN, SDVO, TPM, -25C to +70C
CEQMXT–620L–0: Core™ i7 620LE 2.0GHz, 4MB cache, Type 2, single LAN, SDVO, TPM, -25C to +70C
CEQMXT–620U–0: Core™ i7 620UE 1.06GHz, 4MB cache, Type 2, single LAN,SDVO, TPM, -25C to +70C

Supporting Products:

S–CEQM57XTE–AHS: Active heatsink assembly
S-CE-2GB-DDR3XT: 1GB DDR3 SODIMM Memory, Extended Temp (-25 to +70C )
S-CE-2GB-DDR3IT: 2GB DDR3 SODIMM Memory, Industrial Temp (-40 to +85C )
-S-CE-4GB-DDR3IT: 4GB DDR3 SODIMM Memory, Industrial Temp (-40 to +85C )