Based on the open PICMG® standard, the RadiSys Procelerant™ CE COM Express module combines Intel® Pentium® M and Celeron® M performance with key features vital for today’s embedded applications. Paired with a RadiSys Procelerant™ CR carrier board, the RadiSys family of COM Express modules provides a final production or a design-specific development platform.
COM Express is the PICMG standard for a Computer-On-Module (COM) based on new serial differential signaling technologies such as PCI Express, Serial ATA, USB 2.0, LVDS, and Serial DVO. The COM Express modular concept enables OEMs to reduce time to market by reducing the time spent on processor design and enabling OEMs to focus on their core competencies and product differentiation. The modularity provides the ability for an OEM to plan for feature and performance changes, contributing to the success of the product over its lifetime.
RadiSys COM Express products are ideal for embedded applications that require a standard processor and memory subsystem at the center of their design – and require the modular flexibility to meet customer needs. Other ideal applications include designs that are size constrained and require the small footprint of COM Express.
Whether customers design their own carrier board or utilize RadiSys Design Services to design one, RadiSys supports the design each step of the way. Tools such as the Carrier Design Guide and Thermal Design Guide, as well as schematics and Gerber files are available for customers committed to using RadiSys Procelerant™ CE processor modules. Ask you RadiSys Sales Manager for more information.
| Feature | Function | Description | |
|---|---|---|---|
| Physical | Dimensions | 95mm x 125mm - COM Express Basic Form Factor | |
| Compliance | PICMG COM Express R1.0 Basic Form Factor, Type 2 | ||
| Processor | Options | LV Pentium-M 738 | |
| Performance Clock Speed/FSB/Cache | CE738A LV Pentium®-M: 1.4GHz/400MHz FSB/2MB Cache | ||
| Package | BGA | ||
| Power | 10W (Processor only) | ||
| Chipset | Supplier | Intel® 915GME with ICH6M I/O Hub | |
| Features | Integrated video, PCI, IDE, PCI-Express, SATA, USB, LPC, GPIO | ||
| Memory | Type | Single 200-pin SO-DIMM socket, supports 400 and 533 Memory | |
| Capacity | Up to 1GB DDR2 in a single channel | ||
| BIOS | Type | 1MB, Phoenix Technologies | |
| Audio | Compliance | AC ‘97 Intel High Definition Audio via ICH6M I/O Hub | |
| Video | Type | Dual Independent Displays via Intel 915GM Chipset | |
| Features | Dual SVDO, LVDS 18-bit dual channel, Analog VGA, TV Out | ||
| External | PCI-Express x16 Graphics Port, Multi-plexed on SDVO interface pins | ||
| Networking | Type | IEEE 802.3 10BASE-T/100BASE-TX/1000BASE-T Compliant Physical Layer via Intel 82573V - Utilizes (1) PCI-Express x1 interface | |
| I/O | USB | Eight USB 2.0 / 1.1 ports | |
| SATA | Two SATA 150 ports | ||
| IDE | One Ultra ATA100/66/33 port | ||
| OTHER | LPC, Smbus/I2C Bus | ||
| Super I/O | BIOS Support | National Semiconductor PC8374, Ask about support for Winbond W83627HF-AW | |
| Expansion | PCI Express | 3*PCI-Express x1 and 1*PCI-Express x16 | |
| PCI | PCI 2.3 32-bit 33MHz, four logical devices | ||
| Connectors | COM Express | (2) 220 pin COM Express standard connectors. | |
| Power | Input | 12V input from carrier board (5V standby) | |
| Dissipation: 3D Mark (Max) |
CE738A: 20.7W | ||
| Physical Specifications | |||
|---|---|---|---|
| Environment | Temperature | Operating | 0°C – 60°C |
| Non-Operating | -40°C – 85°C | ||
| Humidity | Operating | 5% to 95% Condensing | |
| Non-Operating | 5% – 90% RH Non-Condensing at 40°C | ||
| Shock | 30G, trapezoidal 11ms duration | ||
| Vibration | Operating | 30G, half sine 11ms duration | |
| Storage | 50G, half sine 11ms duration 30G | ||
| Regulatory | Safety | UL60950-1, EN60950-1, IEC60950-1 | |
| EMC | EN55022, EN55024 and FCC Part 15, Subpart B, Class B. | ||
| Warranty | Two years | ||
Call for pricing and availability. Refer to the order codes below.
Supporting Products:
CE-PHSA: Passive Heatsink & Assembly
